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Thu, December 5, 2024

Broadcom Delivers Industry's First 3.5D F2F Technology for AI XPUs


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  PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiPâ„¢) platform technology, enabling consumer AI customers to develop next-generation ...





Read the Full The Globe and Mail Article at:
[ https://www.theglobeandmail.com/investing/markets/stocks/AVGO-Q/pressreleases/29912003/broadcom-delivers-industrys-first-35d-f2f-technology-for-ai-xpus/ ]

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