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Broadcom Delivers Industry's First 3.5D F2F Technology for AI XPUs


//stocks-investing.news-articles.net/content/202 .. try-s-first-3-5d-f2f-technology-for-ai-xpus.html
Published in Stocks and Investing on Saturday, December 7th 2024 at 10:00 GMT by The Globe and Mail   Print publication without navigation

  • PALO ALTO, Calif., Dec. 05, 2024 (GLOBE NEWSWIRE) -- Broadcom Inc. (NASDAQ: AVGO) today announced the availability of its 3.5D eXtreme Dimension System in Package (XDSiP
  • ) platform technology, enabling consumer AI customers to develop next-generation ...





Read the Full The Globe and Mail Article at:
[ https://www.theglobeandmail.com/investing/markets/stocks/AVGO-Q/pressreleases/29912003/broadcom-delivers-industrys-first-35d-f2f-technology-for-ai-xpus/ ]

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